1,335 research outputs found

    Creep-Rupture Data Analysis - Engineering Application of Regression Techniques

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    The results are presented of investigations to apply regression techniques to the development of methodology for creep-rupture data analysis. Regression analysis techniques are applied to the explicit description of the creep behavior of materials for space shuttle thermal protection systems. A regression analysis technique is compared with five parametric methods for analyzing three simulated and twenty real data sets, and a computer program for the evaluation of creep-rupture data is presented

    Video camera system for locating bullet holes in targets at a ballistics tunnel

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    A system consisting of a single charge coupled device (CCD) video camera, computer controlled video digitizer, and software to automate the measurement was developed to measure the location of bullet holes in targets at the International Shooters Development Fund (ISDF)/NASA Ballistics Tunnel. The camera/digitizer system is a crucial component of a highly instrumented indoor 50 meter rifle range which is being constructed to support development of wind resistant, ultra match ammunition. The system was designed to take data rapidly (10 sec between shoots) and automatically with little operator intervention. The system description, measurement concept, and procedure are presented along with laboratory tests of repeatability and bias error. The long term (1 hour) repeatability of the system was found to be 4 microns (one standard deviation) at the target and the bias error was found to be less than 50 microns. An analysis of potential errors and a technique for calibration of the system are presented

    Structures and materials technology issues for reusable launch vehicles

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    Projected space missions for both civil and defense needs require significant improvements in structures and materials technology for reusable launch vehicles: reductions in structural weight compared to the Space Shuttle Orbiter of up to 25% or more, a possible factor of 5 or more increase in mission life, increases in maximum use temperature of the external surface, reusable containment of cryogenic hydrogen and oxygen, significant reductions in operational costs, and possibly less lead time between technology readiness and initial operational capability. In addition, there is increasing interest in hypersonic airbreathing propulsion for launch and transmospheric vehicles, and such systems require regeneratively cooled structure. The technology issues are addressed, giving brief assessments of the state-of-the-art and proposed activities to meet the technology requirements in a timely manner

    Microstructural characterization of the HRSI thermal protection system for space shuttle

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    Components of the space shuttle high temperature reusable surface insulation (HRSI) system were microscopically characterized, both separately and as a system, to obtain information needed for stress analysis models of the thermal protection system. A tension specimen of the HRSI system was loaded in steps and was microscopically observed at each load condition to demonstrate the tension failure mode associated with strain isolation pad (SIP) behavior. A local failure occurred which should be associated with transfer of load through transverse fibers in the SIP. Stress concentrations attributed to the SIP behavior necessitated strengthening of the HRSI by densification of the RSI at the bondline. An HRSI tile was microscopically characterized after the densification process. The densified surface layer blended into the RSI which caused a gradual change in density. The gradation in density does not appear to represent a sharp discontinuity in elastic modulus between the densified layer and the parent material

    Room temperature mechanical properties of shuttle thermal protection system materials

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    Tests were conducted at room temperature to determine the mechanical properties and behavior of materials used for the thermal protection system of the space shuttle. The materials investigated include the LI-900 RSI tiles, the RTV-560 adhesive and the .41 cm (.16 thick) strain isolator pad (SIP). Tensile and compression cyclic loading tests were conducted on the SIP material and stress-strain curves obtained for various proof loads and load cyclic conditioning. Ultimate tensile and shear tests were conducted on the RSI, RTV, and SIP materials. The SIP material exhibits highly nonlinear stress-strain behavior, increased tangent modulus and ultimate tensile strength with increased loading rate, and large short time load relaxation and moderate creep behavior. Proof and cyclic load conditioning of the SIP results in permanent deformation of the material, hysteresis effects, and much higher tensile tangent modulus values at large strains

    Mass loss of TEOS-coated RCC subjected to the environment at the shuttle wing leading edge

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    Coated, reinforced carbon-carbon (RCC) is used for the leading edges of the Space Shuttle. The mass loss characteristics of RCC specimens coated with tetra-ethyl-ortho-silicate (TEOS) were determined for conditions which simulated the entry environment expected at the stagnation area of the wing leading edge. Maximum specimen temperature was 1632 K. Specimens were exposed for up to 100 missions. Stress levels up to 8.274 MPa caused an average increase in oxidation of 6 percent over unstressed specimens. Experimentally determined mass losses were compared with those predicted by an existing empirical analysis

    Microwave Electronics

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    Contains research objectives and reports on three research projects.U.S. Navy (Office of Naval Research) under Contract Nonr-1841(49)U.S. Air Force under Air Force Contract AF19(604)-5200Lincoln Laboratory, Purchase Order DDL-B22

    Microwave Electronics

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    Contains reports on four research projects.Lincoln Laboratory (Purchase Order B-00306)United States Air Force (Contract AF19(604)-5200)United States NavyUnited States Arm

    Noise in Electron Devices

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    Contains research objectives and reports on two research projects

    Noise in Electron Devices

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    Contains research objectives and reports on one research project.Lincoln Laboratory, Purchase Order DDL B-00368U. S. Air Force under Air Force Contract AF19(604)-7400U. S. NavyU. S. Arm
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